Heat removal assembly

ABSTRACT

A heat removal assembly is provided herein. The heat removal assembly includes an evaporator block, a heat pipe, and a condenser plate. The evaporator block removes heat from an electronic component. The evaporator block engages with the electronic component and forms a thermal connection therebetween that removes the heat from the electronic component. The heat pipe connects to the evaporator block to remove heat from the evaporator block. The condenser plate connects to the heat pipe and receives heat from the heat pipe. The condenser plate includes a thermal mating surface that mates with a thermal member, such that the heat is removed from the assembly via the thermal mating surface.

BACKGROUND

Electronic components or electronic devices have temperaturerequirements. Heat from the use of the electronic components is removedusing an assembly and/or a system to remove the heat. Removal of heatfrom electronic components varies depending on the type of electroniccomponents and the structure surrounding of electronic components.

BRIEF DESCRIPTION OF THE DRAWINGS

Non-limiting examples of the present disclosure are described in thefollowing description, read with reference to the figures attachedhereto and do not limit the scope of the claims. In the figures,identical and similar structures, elements or parts thereof that appearin more than one figure are generally labeled with the same or similarreferences in the figures in which they appear. Dimensions of componentsand features illustrated in the figures are chosen primarily forconvenience and clarity of presentation and are not necessarily toscale. Referring to the attached figures:

FIG. 1 illustrates a block diagram of a system to remove heat accordingto an example;

FIG. 2 illustrates a schematic diagram of the system of FIG. 1 accordingto an example;

FIG. 3 illustrates a block diagram of a heat removal assembly accordingto an example;

FIG. 4 illustrates a perspective view of the assembly of FIG. 3according to an example;

FIG. 5 illustrates a cross-sectional view of a heat pipe according to anexample;

FIG. 6 illustrates a block diagram of a heat removal assembly accordingto an example; and

FIGS. 7-9 illustrate perspective views of the assembly of FIG. 6according to examples.

DETAILED DESCRIPTION

In the following detailed description, reference is made to theaccompanying drawings which form a part hereof, and in which is depictedby way of illustration specific examples in which the present disclosuremay be practiced. It is to be understood that other examples may beutilized and structural or logical changes may be made without departingfrom the scope of the present disclosure.

Electronic components are designed to balance conflicts between powerdensity, spatial layout, temperature requirements, acoustic noise, andother factors. Air cooling systems typically use heat sinks and fans toremove “waste” heat from the electronic component. The use of fans forair cooling may increase the electrical power required to operate theelectronic component and may also cause excessive acoustic noise andlower system density. Removal of heat using air cooling typicallybecomes less efficient as power density increases. Liquid cooling istypically more efficient than air cooling, especially at higher powerdensity; however, liquid cooling typically includes plumbing connectionswithin the electronic components. As the liquid goes through theplumbing connections the risk of leakage of liquid within the electroniccomponent is introduced.

In examples, a heat removal assembly is provided. The heat removalassembly includes an evaporator block, a heat pipe, and a condenserplate. The evaporator block removes heat from an electronic component.The evaporator block engages with the electronic component and forms athermal connection therebetween that removes the heat from theelectronic component. The heat pipe connects to the evaporator block toremove heat from the evaporator block. The condenser plate connects tothe heat pipe and receives heat from the heat pipe. The condenser plateincludes a thermal mating surface that mates with a thermal member, suchthat the heat is removed from the assembly via the thermal matingsurface. The assembly removes the heat from the electronic componentusing heat pipes to allow the liquid cooling to occur away from theelectronic component, reducing the risk of fluid leakage within theelectronic component.

FIG. 1 illustrates a block diagram of a system 100 to remove heataccording to an example. The system 100 includes an electronic component110 and a heat removal assembly 120 that removes heat from theelectronic component 110. The heat removal assembly 120 includes anevaporator block 140, a heat pipe 160, and a condenser plate 180. Theevaporator block 140 engages with the electronic component 110 and formsa thermal connection therebetween. The heat pipe 160 connects to theevaporator block 140 and removes heat from the evaporator block 140. Thecondenser plate 180 connects to the heat pipe 160 and receives heat fromthe heat pipe 160. The condenser plate 180 includes a thermal matingsurface that aligns with a thermal member, such that heat is removedfrom the heat removal assembly 120 via the thermal mating surface.

FIG. 2 illustrates a schematic diagram of the system 100 of FIG. 1according to an example. The system 100 includes an electronic component110 and a heat removal assembly 120 that removes heat from theelectronic component 110. The system 100 as illustrated also includes acooling assembly 200 that receives the heat from the heat removalassembly 120. The heat removal assembly 120 includes an evaporator block140, a heat pipe 160, and a condenser plate 180. The evaporator block140 engages with the electronic component 110 and forms a thermalconnection 246 therebetween. For example, the evaporator block 140 isillustrated as a first and a second evaporator block 140, 240. Each ofthe evaporator blocks 140, 240 have an evaporator thermal surface 242,244 that lie flush with a surface 212, 214 of the electronic component110 and form the thermal connections therebetween 246, 248. The thermalconnections 246, 248 enable transfer of heat from the electroniccomponent 110 to the evaporator blocks 140, 240. The transfer removesheat from the electronic component 110.

The heat pipe 160 thermally connects to the evaporator block 140 andpassively removes heat from the evaporator block 140. The heat pipe 160is illustrated as a first heat pipe 160 and a second heat pipe 260. Thefirst heat pipe 160 connects to the first evaporator block 140 and thesecond heat pipe 260 connects to the second evaporator block 240.

The condenser plate 180 thermally connects to the first and second heatpipes 160, 260 and receives heat from the first and second heat pipes160, 260. The condenser plate 180 includes a thermal mating surface 282that aligns with a thermal member 202. The transferred heat is removedfrom the heat removal assembly 120 via the thermal mating surface 282.The thermal mating surface 282 lies flush with a receiving surface 204of the thermal member 202 and forms a thermal connection 284therebetween. For example, the thermal member 202 is part of the coolingassembly 200 that removes the heat from the system 100 to enable thecooling of the electronic component 110.

The configuration of the second heat pipe 260 may vary to accommodatevarious electronic components 110 and pivot or rotate during assembly ata pivot point or a hinge. For example, the second heat pipe 260 includesa first portion, a second portion, and a bellow therebetween. The firstportion of the second heat pipe 260 connects to the condenser plate 180.The bellow enables the second portion of the second heat pipe 260 topivot with reference the first portion of the second heat pipe 260 andmaintain a thermal connection therebetween. In an alternate example, thesecond heat pipe 260 hingedly connects to the condenser plate 180, suchthat, the second heat pipe 260 rotates the second evaporator block 240into and out of alignment with the electronic component 110. The secondheat pipe 260 and the condenser plate 180 are thermally connected toallow the heat to transfer to the condenser plate 180 and exit the heatremoval assembly 120.

The condenser plate 180 may alternatively or in addition include a firstplate and a second plate. The first plate includes a first thermalmating surface and the second plate includes a second thermal matingsurface. The first plate and the second plate of the condenser plate 180are aligned such that the first thermal mating surface and the secondthermal mating surface align with the thermal member 202. The firstplate and the second plate are aligned using, for example, an alignmentmember formed between the first and second plate. The alignment memberaligns the first plate and the second plate of the condenser plate 180,such that the first thermal mating surface and the second thermal matingsurface align with the thermal member 202 and provides a thermalconnection that transfers the heat from the first and second heat pipes160, 260 to the condenser plate 180. An example of an alignment memberincludes a pin that fits into an aperture formed between the first plateand the second plate of the condenser plate 180.

FIG. 3 illustrates block diagram of a heat removal assembly 120according to an example. The heat removal assembly 120 includes anevaporator block 140, a heat pipe 160, and a condenser plate 180. Theevaporator block 140 removes heat from an electronic component. Theevaporator block 140 engages with the electronic component 110 and formsa thermal connection therebetween. The heat pipe 160 thermally connectsto the evaporator block 140 to passively remove heat from the evaporatorblock 140. The condenser plate 180 thermally connects to the heat pipe160.

The condenser plate 180 receives heat from the heat pipe 160. Thecondenser plate 180 includes a thermal mating surface 282 that alignswith a thermal member 202, such that the heat is transferred from theheat removal assembly 120 via the thermal mating surface 282, asillustrated in FIG. 2.

FIG. 4 illustrates a perspective view of the assembly of FIG. 3according to an example. The heat removal assembly 120 includes anevaporator block 140, a heat pipe 160, and a condenser plate 180. Theevaporator block 140 removes heat from an electronic component. Theevaporator block 140 engages with the electronic component 110 and formsa thermal connection 440 therebetween. For example, the engagementbetween the evaporator block 140 and the electronic component 110 occursat an evaporator thermal surface 442 that lies flush with a portion 412of the electronic component 110 to remove heat therefrom. The thermalconnection 246 is formed by the contact between the surfaces and athermally conductive substance 444, such as ShinEtsu G750 or GrafTechHiTherm thermal grease, may be used between the evaporator thermalsurface 442 and the portion 412 of the electronic component 110 toimprove the thermal connection 440. It is important that a properthermal connection 440 is formed to efficiently and effectively removethe heat from the electronic component 110.

The heat pipe 160 connects to the evaporator block 140 to passivelyremove heat from the evaporator block 140. FIG. 5 illustrates across-sectional view of a heat pipe 160 according to an example.Referring to FIG. 5, the heat pipe 160 includes a heat pipe wall 510, awicking portion 520, and a vapor channel 530. The heat pipe 160 isformed of, for example, copper tubing. The copper tubing receives heat550 from a heat source, such as electronic component 110, via theevaporator block 140. Heat 550 is transferred from the evaporator block140 through the heat pipe wall 510 of the heat pipe 160, into thewicking portion 520. The wicking portion 520 includes, for example,sintered type wicks, groove type wicks, wire bundle wicks, or wire meshwicks. A liquid phase working fluid 522 such as water is present in thewicking portion 520 adjacent to evaporator block 140. The liquid phaseworking fluid 522 is heated and changes to a vapor 535.

The expansion inherent in vaporization causes the vapor 535 from theliquid phase working fluid 522 to travel along the vapor channel 530, asillustrated by the vapor arrows 532. As the vapor 535 travels down thevapor channel 530 it carries heat along with it. At the opposite end ofthe heat pipe 160, adjacent to the condenser plate 180, the heat pipewalls 510 are held at a lower temperature, by contact with the condenserplate 180. It is necessary to maintain a temperature differential or theheat pipe 160 will cease to efficiently transfer heat 550. In otherwords, the heat is continuously removed from the heat pipe 160 by thecondenser plate 180 to maintain the temperature differential that allowsthe heat pipe 160 to work efficiently.

The lower temperature causes the liquid phase working fluid 522 tocondense onto the wicking portion 520, transferring heat 550 into theheat pipe wall 510, and out to the condenser plate 180. As the vaporousworking fluid 522 condenses into the wicking portion 520, it is drawnback toward the evaporator block 140 end of the heat pipe 160 bycapillary action. This cycle can repeat indefinitely as long as asufficient temperature differential exists between the evaporator block140 and condenser plate 180 ends of the heat pipe 160. The heat 550 isremoved from the heat pipe 160 via the condenser plate 180 that collectsthe heat 550 from the vapor 535.

The quantity, size and shape of the heat pipes 160 may vary dependingupon the configuration of the electronic component 110, the evaporatorblock 140, and the condenser plate 180 that connects to the heat pipe160. The connection between the evaporator block 140 and the condenserplate 180 is typically rigid. For example, the heat pipe 160 is solderedto the evaporator block 140 and the condenser plate 180.

Referring back to FIG. 4, the condenser plate 180 connects to the heatpipe 160. The condenser plate 180 receives heat from the heat pipe 160.The condenser plate 180 includes a thermal mating surface 282 thataligns with a thermal member 202, such that the heat is removed from theheat removal assembly 120 via the thermal mating surface 282, asillustrated in FIG. 2. The thermal mating surface 282 lies flush with areceiving surface 204 of the thermal member 202. For example, thethermal mating surface 282 is a contiguous mating surface that mateswith the receiving surface 204 of the thermal member 202. A thermalconnection 284 is formed between the thermal mating surface 282 and thereceiving surface 204 by direct contact or using a thermally conductivesubstance 444 such as ShinEtsu G750 or GrafTech HiTherm thermal grease.It is important that the thermal connection 284 is properly formed toefficiently and effectively transfer the heat from the heat removalassembly 120 to the thermal member 202.

The thermal member 202 may be part of a cooling assembly 200, such as athermal bus bar that provides rack level cooling away from theelectronic components 110. The heat removal assembly 120 connects to thecooling assembly 200 using, for example, fasteners and/or brackets 490that connect and/or secure the condenser plate 180 to a portion of thecooling assembly 200, such as a portion that allows the condenser plate180 and the thermal member 202 to mate and form a thermal connection 482therebetween.

The electronic component 110 usable with the heat removal assembly 120may include one or more heat producing supplementary devices 464, suchas memory attached to the electronic component 110. For instance, largedevices such as a Graphical Processing Unit may be surrounded by memoryon both sides or surfaces of the printed circuit board (PCB). The heatproducing supplementary devices 464 may also be contained within theheat removal assembly 120. For example, memory, power supply devices, orother supplementary electronic devices 464 may also be installed on themounting of the PCB. The heat producing supplementary devices may alsobe thermally attached to the evaporator block 140 for removal of wasteheat.

FIG. 6 illustrates block diagram of a heat removal assembly 120according to an example. The heat removal assembly 120 includes a firstevaporator block 140, a first heat pipe 160, a second evaporator block240, a second heat pipe 260, and a condenser plate 180. The firstevaporator block 140 removes heat from a first surface 212 of anelectronic component 110. The first evaporator block 140 engages withthe first surface 212 of the electronic component 110 and forms a firstthermal connection 246 therebetween. For example, engagement between thefirst evaporator block 140 and the electronic component 110 occurs at anevaporator thermal surface (i.e., 242 of FIGS. 2 and 4) that lies flushwith a surface (i.e., 212 of FIGS. 2 and 4) of the electronic component110 to remove heat from the electronic component 110. The first heatpipe 160 connects to the first evaporator block 140 to remove heat fromthe first evaporator block 140.

The second evaporator block 240 removes heat from a second surface 214of the electronic component. The second evaporator block 240 engageswith the electronic component 110 and forms a second thermal connection248 between evaporator thermal surface 244 and the second surface 214 ofthe electronic component. For example, engagement between the secondevaporator block 240 and the electronic component 110 occurs at anevaporator thermal surface (i.e., 244 of FIG. 2) that lies flush with asurface (i.e., 214 of FIGS. 2 and 4) of the electronic component 110 toremove heat from the electronic component 110. The second heat pipe 260connects to the second evaporator block 240 to remove heat from thesecond evaporator block 260. The configuration of the second heat pipe260 may vary to accommodate various electronic components 110 and pivotor rotate during assembly at a pivot point or a hinge.

The condenser plate 180 connects to the first and second heat pipes 160,260 and receives heat from the first and second heat pipes 160, 260. Thecondenser plate 180 includes a thermal mating surface 282 that mates oraligns with a thermal member 202, as illustrated in FIGS. 2 and 4. Thethermal mating surface 282 mates with the thermal member 202, forexample, in a position flush with a receiving surface 204 of the thermalmember 202. The thermal member 202 is part of the cooling assembly 200that removes the heat from the system 100 to enable the cooling of theelectronic component 110. The heat is removed from the heat removalassembly 120 via the thermal mating surface 282.

FIGS. 7-9 illustrate perspective views of the assembly of FIG. 6according to examples. Each assembly includes two evaporator blocks 140,240 to cool an electronic component 110. The two evaporator blocks 140,240 are each on a distinct side of the electronic component 110,illustrated on two opposing sides in FIGS. 7-9. The heat removalassembly 120 cools both sides of the electronic component 110 when forexample, there are chips on both sides of a system board, such as ageneral purpose graphical processing unit (GPGPU) or a graphicalprocessing unit (GPU) with dynamic random-access memory (DRAM) chips ontwo opposing surfaces of the system board (i.e., a top and bottomsurface of the system board). Other examples of electronic components110 includes a central processing unit (CPU), dual in-line memorymodules (DIMMs), a power supply board, a disk device, and a battery.

Cooling two opposing sides of the electronic component 110 ischallenging when using evaporator blocks. Evaporator blocks 140, 240 aremore efficient and effective than air for cooling electronic components110 when the evaporator blocks include a very flat surface to mate oralign with the electronic component 110. Heat pipes 160, 260 aretypically rigidly soldered between the evaporator blocks 140, 240 andthe condenser plate 180. The condenser plate 180 is also more efficientand effective when a very flat surface of the condenser plate 180 matesor aligns with a thermal member 202. The surface profile of theelectronic component 110, such as a system board, makes it virtuallyimpossible to install two rigidly joined evaporator blocks 140, 240between the system board without compromising the surface flatness ofthe evaporator blocks 140, 240 and/or the condenser plate 180.

Referring to FIGS. 7-9, the first and second evaporator blocks 140, 240are similar to one another, and the first heat pipe 160 is not altered.However, the second heat pipe 260 and/or the condenser plate 180 aremodified to accommodate the electronic component 110 between twoevaporator blocks 140, 240 and provide proper thermal connectionsbetween the electronic component 110 and both of the first and secondevaporator blocks 140, 240. FIGS. 7-8 each illustrate an example ofmodifications to the configuration of the second heat pipe 260 thatpivots or rotates during assembly to accommodate the electroniccomponent 110 and aligns with the electronic component 110 toefficiently cool the electronic component 110.

Referring to FIG. 7, the second heat pipe 260 includes a first portion762, a second portion 764, and a bellow 766. The first portion 762 ofthe second heat pipe 260 connects to the condenser plate 180. The secondportion 764 of the second heat pipe 260 connects to the secondevaporator block 240. The bellow 766 is formed between the first portion762 and the second portion 764. FIG. 7 illustrates a cut-out of aportion of the bellow 766 that includes a wick member 770, for example awire bundle or wire mesh to enhance internal fluid return in the area ofthe bellow 766. The outer surface 768 of the bellow 766 is formed of aconductive material, such as copper that enables a thermal connection765, 767 to remain between the first portion 762 and the second portion764 of the heat pipe 260.

The bellow 766 enables the second portion 764 of the second heat pipe260 to rotate a with reference to the first portion 762, i.e., about anaxis A extending from the first portion 762 of the second heat pipe 260.For example, the second portion 764 rotates between two positions α₁,α₂, such that the second heat pipe 260 moves the evaporator block 240into and out of alignment with the electronic component 110. Forexample, the bellow 766 provides a predefined amount of separationbetween the first and second evaporator blocks 140, 240 that allow spaceto position the electronic component 110 between the first and secondevaporator blocks 140, 240. The bellow 766 enables the second evaporatorblock 240 to move between two positions. In a first position α₁, thesecond evaporator block 240 is flush or contacts a portion of theelectronic component 110 when assembled such that a thermal connection246, 248 is formed between the electronic component 110 and both thefirst evaporator block 140 and the second evaporator block 240. Forexample, each evaporator thermal surface 242, 244 mates or aligns withan electronic surface 212, 214 of the electronic component 110.

The thermal connection may be improved by adding a thermally conductivesubstance 444, such as ShinEtsu G750 or GrafTech HiTherm thermal grease,between the evaporator thermal surfaces 242, 244 of the evaporatorblocks 140, 240 and the electronic surfaces 212, 214. In a secondposition α₂, the second evaporator block 240 rotates to increase theamount of space or separation between the first and second evaporatorblocks 140, 240 to allow insertion of the electronic component 110. Forexample, if the electronic component 110 installed needs to be removedand/or a new electronic component needs to be installed, the second heatpipe 260 rotates the second evaporator block 240 to the second positionα₂, which is out of contact with the electronic component 110. Theflexible structure of the bellow 766 allows rotation of the evaporatorblock 240 to install and/or remove the electronic component 110.

Referring to FIG. 8, the second heat pipe 260 hingedly connects to thecondenser plate 180. The hinge 860 is formed for example, using a pin880 that extends through the second heat pipe 260 and the condenserplate 180. The hinge 860 enables the second heat pipe 260 to pivot orrotate, β, about a point b on an axis B that extends through the pin880. The hinge 860 enables the second evaporator block 240 to move intoand out of alignment with the electronic component 110, i.e., positions(β1 and β2. The movement of the second evaporator block 240 via thehinge 860 enables the electronic component 110 to be reversed and/orinserted. A thermal connection is provided between the second heat pipe260 and the condenser plate 180 to allow the heat to transfer to thecondenser plate 180 and exit the heat removal assembly 120. For example,not only is the second heat pipe 260 and the condenser plate 180 formedof a thermal material, such as copper. Additionally, a thermallyconductive substance 444, such as ShinEtsu G750 or GrafTech HiThermthermal grease, may also be used between the hinge 860 to transfer heatand increase the thermal connection therebetween.

Referring to FIG. 9, the second heat pipe 260 is soldered between thesecond evaporator block 240 and the condenser plate 180. The condenserplate 180 is modified to include two portions, a first plate 982 and asecond plate 984. The first plate 982 includes a first thermal matingsurface 983 and the second plate 984 of the condenser plate 180 includesa second thermal mating surface 985. The first and second plate 982, 984of the condenser plate 180 are aligned such that the first thermalmating surface 983 and the second thermal mating surface 985 align witha thermal member 202, i.e., the thermal member 202 may be part of acooling assembly 200, as illustrated in FIG. 2.

For example, the first and second thermal mating surfaces 983, 985 areformed of two contiguous mating surfaces that mate with the receivingsurface 204 of the thermal member 202. A thermal connection 987, 989 isformed between each of the first and second thermal mating surfaces 983,985 and the receiving surface 204 by direct contact and/or a thermallyconductive substance 444 such as ShinEtsu G750 or GrafTech HiThermthermal grease. It is important that the thermal connections 987, 989are properly formed to efficiently and effectively transfer the heatfrom the heat removal assembly 120 to the thermal member 202.

Proper alignment between the first and second plate 982, 984 aids withforming and maintaining the proper thermal connections 987, 989. Forexample a first thermal connection is needed between the first thermalmating surface 983 and the receiving surface 204 of the thermal member202, and a second thermal connection is needed between the secondthermal mating surface 985 and the receiving surface 204 of the thermalmember 202. The first plate 982 transfers the heat from the first heatpipe 160 from the heat removal assembly 120 to the thermal member 202and the second plate 984 transfers heat from the second heat pipe 260 tothe thermal member 202. It is important that the first plate 982 and thesecond plate 984 each have a thermal connection with the thermal member202 (i.e., a thermal connection between the first thermal mating surface983 and the receiving surface 204 and the second thermal mating surface985 and the receiving surface 204) to efficiently and effectively removeheat from the heat removal assembly 120. However, when there is athermal connection between the first plate and the thermal member 202and the second plate 984 and the thermal member 202, there is no need toa thermal connection to exist between the first and second plates 982,984 since the heat removed by the first and second thermal matingsurfaces 983, 985 of the first and second plates 982, 984, respectively.

The first and second plates 982, 984 are formed such that the two platesmay be moved into and out of alignment with one another (i.e., separatedand realigned), as illustrated by movement arrow 990 and the dottedportions of the assembly 120. For example, the second plate 984 may bemoved up and down relative to the first plate 982 to provide an amountof clearance between the first and second evaporator blocks 140, 240that allows the electronic component 110 to fit between the first andsecond evaporator blocks 140, 240. Although FIG. 9 illustrates thesecond heat pipe 260 soldered to the evaporator block 240 and condenserplate 180 without a bellow 766 or hinge 860, the second heat pipe 260,as illustrated in FIGS. 7-8 may also be used with the a condenser plate180 having two portions, as illustrated in FIG. 9.

The first plate 982 and the second plate 984 of the condenser plate 180are aligned or realigned using, for example, an alignment member 986formed between the first and second portion of the condenser plate 180.The alignment member 986 aligns the first plate 982 and the second plate984 of the condenser plate 180, such that the first thermal matingsurface 983 and the second thermal mating surface 985 align with thethermal member 202 and provide the thermal connections 987, 989 thattransfer the heat from the first and second heat pipes 160, 260 to thecondenser plate 180. The alignment member 986 aligns the first andsecond plates 982, 984 to position the first and second thermal matingsurfaces 983, 985 together to form a very flat surface to mate with athermal member 202. The use of the alignment member 986 is used to aidin easily and consistently positioning the first and second thermalmating surfaces 983, 985 to allow both the first and second plates 982,984 to efficiently and effectively transfer heat from the heat removalassembly 120 to the thermal member 202.

An example of an alignment member 986 includes a pin 992 that fits intoan aperture 994 formed between the first and second plates 982, 984 ofthe condenser plate 180. For example, the aperture 994 is illustrated asformed in the first plate 982 and the pin 992 is formed in the secondplate 984; however, the aperture 994 may be formed in the second plate984 and the pin 992 may be formed in the first plate 982. Alternativelythe pin 992 may be separate from the first and second plates 982, 984and both the first and second plates 982, 984 may include an aperture994 formed therein to receive the pin 992 and align the first and secondplates 982, 984. The first and second plate 982, 984 are then heldtogether using fasteners 996, such as screws or clips.

The present disclosure has been described using non-limiting detaileddescriptions of examples thereof and is not intended to limit the scopeof the present disclosure. It should be understood that features and/oroperations described with respect to one example may be used with otherexamples and that not all examples of the present disclosure have all ofthe features and/or operations illustrated in a particular figure ordescribed with respect to one of the examples. Variations of examplesdescribed will occur to persons of the art. Furthermore, the terms“comprise,” “include,” “have” and their conjugates, shall mean, whenused in the present disclosure and/or claims, “including but notnecessarily limited to.”

It is noted that some of the above described examples may includestructure, acts or details of structures and acts that may not beessential to the present disclosure and are intended to be exemplary.Structure and acts described herein are replaceable by equivalents,which perform the same function, even if the structure or acts aredifferent, as known in the art. Therefore, the scope of the presentdisclosure is limited only by the elements and limitations as used inthe claims.

What is claimed is:
 1. A heat removal assembly comprising: an evaporatorblock to remove heat from an electronic component, the evaporator blockto engage with the electronic component and form a thermal connectiontherebetween that removes heat from the electronic component; a heatpipe connects to the evaporator block to remove heat from the evaporatorblock; a condenser plate connects to the heat pipe to receive heat fromthe heat pipe, the condenser plate including a thermal mating surfacethat mates with a thermal member, such that the heat is removed from theassembly via the thermal mating surface.
 2. The assembly of claim 1,wherein the thermal mating surface lies flush with a receiving surfaceof the thermal member.
 3. The assembly of claim 1, wherein theevaporator block further comprises an evaporator thermal surface thatlies flush with a portion of the electronic component to remove heattherefrom.
 4. The assembly of claim 1, wherein the condenser platecomprises a first plate and a second plate, the first plate including afirst thermal mating surface and the second plate including a secondthermal mating surface, the first plate and the second plate alignedsuch that the first thermal mating surface and the second thermal matingsurface mate with the thermal member.
 5. The assembly of claim 4,further comprising an alignment member formed in the condenser plate toalign the first plate and the second plate such that the first thermalmating surface and the second thermal mating surface mate with thethermal member.
 6. The assembly of claim 1, wherein the heat pipeincludes a first portion, a second portion, and a bellow therebetween,the first portion connects to the condenser plate, the bellow enablesthe second portion of the heat pipe to pivot with reference to the firstportion of the heat pipe.
 7. The assembly of claim 1, wherein the heatpipe pivotally connects to the condenser plate, the heat pipe and thecondenser plate provides a thermal connection that transfers the heatfrom the heat pipe to the condenser plate.
 8. A system to remove heatcomprising: an electronic component; and a heat removal assemblyincluding: an evaporator block to remove heat from the electroniccomponent, the evaporator block to engage with the electronic componentand form a thermal connection therebetween that removes heat from theelectronic component; a heat pipe connects to the evaporator block toremove heat from the evaporator block; and a condenser plate connects tothe heat pipe to receive heat from the heat pipe, the condenser plateincluding a thermal mating surface that aligns with a thermal member,such that the heat is removed from the assembly via the thermal matingsurface.
 9. The system of claim 8, wherein: the thermal mating surfacelies flush with a receiving surface of the thermal member; and theevaporator block further comprises an evaporator thermal surface thatlies flush with a portion of the electronic component to remove heattherefrom.
 10. The system of claim 8, wherein the condenser platecomprises a first plate and a second plate, the first plate including afirst thermal mating surface and the second plate including a secondthermal mating surface, the first plate and the second plate alignedsuch that the first thermal mating surface and the second thermal matingsurface aligns with the thermal member.
 11. The system of claim 10,further comprising an alignment member formed between the first andsecond portion of the condenser plate to align the first plate and thesecond plate of the condenser plate, such that the first thermal matingsurface and the second thermal mating surface align with the thermalmember, and the first thermal mating surface and the second thermalmating surface provide a thermal connection that transfers the heat fromthe heat pipe to the condenser plate.
 12. The system of claim 11,wherein the alignment member comprises a pin that fits into an apertureformed between the first plate and the second plate of the condenserplate.
 13. The system of claim 8, wherein the heat pipe comprises afirst heat pipe and a second heat pipe; and the evaporator blockcomprises a first and second evaporator block, the first heat pipeconnects to the first evaporator block and the second heat pipe connectsto the second evaporator block, the second heat pipe including a firstportion, a second portion, and a bellow therebetween, the first portionof the second heat pipe connects to the condenser plate, the bellowenables the second portion of the second heat pipe to pivot withreference to the first portion of the second heat pipe and maintain athermal connection therebetween.
 14. The system of claim 8, wherein theheat pipe comprises a first heat pipe and a second heat pipe; and theevaporator block comprises a first and second evaporator block, thefirst heat pipe connects to the first evaporator block and the secondheat pipe connects to the second evaporator block, the second heat pipehingedly connects to the condenser plate such that the second heat pipe:rotates the second evaporator block into and out of alignment with theelectronic component, and provides a thermal connection between thesecond heat pipe and the condenser plate.
 15. A heat removal assemblycomprising: a first evaporator block to remove heat from a first surfaceof an electronic component, the first evaporator block to engage withthe first surface of the electronic component and form a first thermalconnection therebetween that removes heat from the electronic component;a first heat pipe connects to the first evaporator block to remove heattherefrom; a second evaporator block to remove heat from a secondsurface of the electronic component, the second evaporator block toengage with the electronic component and form a second thermalconnection therebetween that removes heat from the electronic component;a second heat pipe connects to the second evaporator block to removeheat therefrom; and a condenser plate connects to the first heat pipeand the second heat pipe to receive heat therefrom, the condenser plateincluding a thermal mating surface that mates with a thermal member,such that the heat is removed from the assembly via the thermal matingsurface.